Product Overview
PM-300Cu Copper Powder is a premium-grade, spherical copper powder engineered for high-performance powder metallurgy (PM), additive manufacturing (AM), and conductive paste formulations. With a precisely controlled particle size distribution (D50 = 22 μm) and exceptional sphericity (>95%), this spherical copper powder ensures outstanding flowability, high packing density, and uniform layer spreading—critical for consistent green strength and dimensional accuracy in near-net-shape sintering and laser powder bed fusion (LPBF). As a high conductivity powder, PM-300Cu delivers superior electrical and thermal performance post-sintering, making it ideal for demanding electro-thermal components. Fully compliant with RoHS Directive 2011/65/EU, this RoHS copper powder contains zero restricted substances (Pb, Cd, Hg, Cr⁶⁺, PBB, PBDE), supporting sustainable manufacturing and global market access. Whether you're developing high-efficiency motor parts, RF shielding components, or conductive inks, copper powder PM-300Cu offers reproducible quality, traceable batch documentation, and full regulatory assurance.
Key Features
- High sphericity (>95%) for optimal flow and packing density
- Narrow particle size distribution (D10 ≈ 14 μm, D50 = 22 μm, D90 ≈ 32 μm)
- Ultra-low oxygen content (< 200 ppm) to minimize oxide formation during sintering
- High bulk density (≥4.2 g/cm³) and tap density (≥4.8 g/cm³)
- Excellent surface cleanliness and minimal satellite particles
- RoHS compliant and REACH registered
- Supplied in vacuum-sealed, nitrogen-purged aluminum-laminated bags
- Full QC certification: SEM imaging, laser diffraction, O/N/H analysis, and Hall flow rate testing
Technical Specifications
| Parameter |
Value |
| Product Name |
PM-300Cu |
| Chemical Composition |
Cu ≥ 99.95% (min), O ≤ 200 ppm, Fe ≤ 10 ppm, Ni ≤ 5 ppm, Pb ≤ 5 ppm |
| Particle Morphology |
Spherical (>95% sphericity) |
| D50 Particle Size |
22 ± 1 μm |
| D10 / D90 |
≈14 μm / ≈32 μm |
| Bulk Density |
≥4.2 g/cm³ |
| Tap Density |
≥4.8 g/cm³ |
| Hall Flow Rate |
≤25 s/50g |
| Oxygen Content |
≤200 ppm |
| RoHS Compliance |
Yes (2011/65/EU) |
| Packaging |
Vacuum-sealed, N₂-purged 1 kg / 5 kg laminated aluminum bags |
| Storage Conditions |
Cool, dry, inert atmosphere; avoid moisture and oxidation |
Applications
This high conductivity powder is widely adopted across advanced manufacturing sectors: powder metallurgy of high-conductivity electrical contacts and heat sinks; binder jetting and LPBF of copper-based thermal management systems; formulation of conductive pastes for thick-film electronics, EMI shielding coatings, and flexible printed circuits; and as a functional filler in high-performance polymer composites. Its RoHS copper certification enables seamless integration into automotive electronics, medical devices, 5G infrastructure, and aerospace-grade components—where reliability, regulatory compliance, and copper powder purity are non-negotiable.
EN
